一種基于紅外熱成像技術(shù)的星載EPC可靠性狀態(tài)檢測方案研究
A New Reliability Detection Method of Spaceborne EPC Based on Infrared Thermal Imaging Technique
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摘要: 該文針對星載EPC(Electronic Power Conditioner)可靠性狀態(tài)檢測問題引入了一種非接觸式的紅外熱成像檢測方法，介紹了應(yīng)用該方法進(jìn)行可靠性狀態(tài)檢測的理論依據(jù)及其檢測系統(tǒng)構(gòu)成；并在應(yīng)用該系統(tǒng)對星載EPC樣機進(jìn)行了大量試驗研究的基礎(chǔ)上，依據(jù)數(shù)理統(tǒng)計理論和歐氏距離判別方法，首次提出了一個有效的基于紅外熱成像技術(shù)的PCB(Printed Circuit Board)可靠性狀態(tài)檢測數(shù)學(xué)模型。
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關(guān)鍵詞:
- 星載EPC; 紅外熱成像; 歐氏距離判別方法; 可靠性狀態(tài)檢測模型
Abstract: Especially for the reliability state detection of space borne EPC, infrared thermal imaging technique, a new non-contact detection method, and its detection principle and the constitution of the detection system are introduced; and then, after plenty of test by applying this detection method on the space borne EPC sample, a new effective mathematical model of the PCB reliability detection, which based on mathematical statistics and Euclidean distance discrimination means, is brought forward first time. -
Kaplan H, et al.. The infrared automatic mass screening(IRAMS) system for printed circuit board diagnosis. IEEE International Automatic Testing Conference, San Antonio, TX, 1986: 301-306.[2]Wallin B. Real-time temperature on PCBs, hybrids and microchips, thermosense Ⅷ: Proc. of SPIE, the International Society for Optical Engineering, Orlando, Florida, 1991, 1467: 180-187.[3]J. Walcutt, Thermal imaging critical for todays complex circuits. Evaluation Engineering(EE),1993, 32(10): 50-53.[4]王格芳.基于紅外熱成像的集成電路檢測與診斷.激光與紅外,1999,29(5):315-317.[5]候成剛等.紅外熱成像技術(shù)對印刷電路板故障的診斷能力.紅外技術(shù),1996,18(6):37-41.[6]戴鍋生.傳熱學(xué)(第二版).北京:高等教育出版社,1999:188-196.[7]程玉蘭.紅外診斷現(xiàn)場實用技術(shù).北京:機械工業(yè)出版社,2002:1-19.[8]Thermal Tracer TH7102MX/WX Operation Manual, NEC San-ei Instruments, Ltd. 2001.[9]應(yīng)用數(shù)學(xué)教研室.數(shù)理統(tǒng)計.西安:西北工業(yè)大學(xué)出版社,1997:167-170.[10]邊肇祺等.模式識別(第二版).北京:清華大學(xué)出版社,2000:185-188. -
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