硅與玻璃靜電封接機(jī)理的研究
THE STUDY ON SILICON AND GLASS ELECTROSTATIC BONDING MECHANISM
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摘要: 本文利用板殼理論,分析在硅與玻璃靜電封接時(shí),硅與玻璃界面間的靜電力與硅片彎曲應(yīng)力的關(guān)系;推導(dǎo)出封接成功的條件,即界面間距d與電壓V,剛度D,撓度等的關(guān)系,并進(jìn)行了實(shí)驗(yàn)驗(yàn)證。
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關(guān)鍵詞:
- 靜電封接; 靜電力; 板殼理論; 硅; 玻璃
Abstract: The theory of plate and shell is used to analyze the problem of electrostatic bonding of glass with silicon plate. This problem is to find Out the relation between the bending stress of silicon plate and the electrostatic force of interface. The conditions of successful bonding are found. A formula among the distance d between the two surfaces and the rigidity D, the bending deflection and the voltage V is derived, and a series of experiments to verify it is performed. -
Barth W. Sensors and System, 1982, 1(1):22-23.[2]馮景星.半導(dǎo)體敏感器件,1987,9(1); 34-36.[3]馮景星.擴(kuò)散硅壓力傳感器中的幾項(xiàng)新技術(shù).STC89首屆全國(guó)敏感元件與傳感器學(xué)術(shù)會(huì)議論文集,北京:1989,11,194-197. -
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