IC缺陷輪廓的分形插值模型
FRACTAL INTERPOLATION MODEL OF IC DEFECT OUTLINES
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摘要: 現(xiàn)用于集成電路(IC)成品率預(yù)報及故障分析的缺陷模型均是用圓或正方形來代替真實缺陷的復(fù)雜輪廓進(jìn)行近似建模的，從而在模型中引入了很大的誤差。本文利用分形插值的思想直接對真實缺陷的輪廓進(jìn)行模擬，從而提出了一種新的缺陷輪廓表征模型。實驗結(jié)果表明：與傳統(tǒng)的最大圓模型、最小圓模型及橢圓模型相比，新模型的建模精度有了很大的提高。
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關(guān)鍵詞:
- IC缺陷;分形插值;IC故障;IC成品率;等效圓形缺陷
Abstract: Available defect outline model used for yield prediction and inductive fault analysis of integrated circuits (IC) all model a real defect by replacing its real rugged outlines with circular discs or squares,then great errors were aroused in these models.Based on the idea of fractal interpolation,this paper presents a new model to characterize those real defect outlines.The comparison of the new model with those models available indicates that the new model is a more accurate defect outline model. -
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