基于光探針的超高速波形數(shù)字化測(cè)試系統(tǒng)的應(yīng)用
APPLICATION OF ULTRA-HIGH SPEED WAVEFORM DIGITIZED SYSTEM TO IC BASED ON LASER PROBE
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摘要: 介紹了基于光探針的超高速波形數(shù)字化系統(tǒng)的結(jié)構(gòu)。采用倍頻移相掃描法測(cè)量了高速集成電路芯片各級(jí)的功能。分析了芯片故障產(chǎn)生的原因和光探針測(cè)量的特點(diǎn)。
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關(guān)鍵詞:
- 光探針; 電光采佯; 集成電路芯片
Abstract: This paper introduces the construction of the ultra-high speed waveform digitized system based on laser probe. The functions of different stages of the high-speed dynamic divider circuit chip are measured with the double-frequency phase sweeping technique. A detail analysis about the chip failure and the characteristics of laser probe measurement is given. -
Kolner B H, Bloom D M. Electronic sampling in GaAs integrated circuits. IEEE J. of QE., 1986,QE-22(1): 79-93.[2]Duvillaret L, Lourtioz J M, Chusseau L. Absolute voltage measurements on Ⅲ-V integrated circuits by internal electro-optic sampling[J].Electron. Lett.1995, 31(1):23-24[3]田小建,衣茂斌,等.倍頻移相掃描電光采樣測(cè)量.紅外與毫米波學(xué)報(bào),1997,16(3):190-192.[4]Mitsuru S, Tadao N. An automated electro-optic probing system for ultra-high-speed ICs. IEEE Trans. on Instrum. Meas., 1994, IM-43(6): 843-847. -
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