PCB上串?dāng)_的耦合機(jī)理和優(yōu)化分析模型
The Coupling Mechanism and Optimization Analysis Model for Crosstalk in PCB
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摘要: 本文從頻域與時域兩個方面分析了PCB上的串?dāng)_的耦合機(jī)理,探究了耦合電容以及近端和遠(yuǎn)端電阻的影響.針對2-串?dāng)_電路模型所提出的時域上的數(shù)學(xué)優(yōu)化模型,明確了信號上升沿對干擾輸出的影響.并且利用Hyperlynx軟件包進(jìn)行仿真,比較了耦合電容、耦合長度等的作用結(jié)果,仿真結(jié)果證明了理論分析的正確性.
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關(guān)鍵詞:
- 耦合電容;串?dāng)_;優(yōu)化;仿真
Abstract: The coupling path of crosstalk in PCB is analyzed both in the frequency and the time domains in this paper. The influence of the coupling capacitance and the resistances near and far from the source in the victim circuit is investigated. The optimization model is derived mathematically in time domain for the 2-n circuit model. The conclusion is deduced that the maximum crosstalk is derived from the rising edge of the aggressive signal. The simulation results by use of Hyperlynx software are compared with regards to the coupling capacitance and the coupling length, which demonstrate the theoretical conclusion. -
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