場發(fā)射錐尖的制備及特性研究
FABRICATION AND CHARACTERISTICS OF FIELD EMISSION ARRAYS
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摘要: 研究了倒金字塔填充型錐尖及正向刻蝕硅尖的制備工藝,采用了兩種封裝結(jié)構(gòu)測試了場發(fā)射硅尖陣列的發(fā)射特性,并分析比較了這兩種結(jié)構(gòu)的特點及用于制備高頻微波器件的可能性。
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關(guān)鍵詞:
- 場致發(fā)射錐尖陣列; 鍵合; 微波器件
Abstract: Field emission arrays are important to vacuum microelectronic microwave devices. The downward pyramid filled cone and upward etched silicon cone are fabricated. Two kinds of packing structures are used and the emission properties of these cones are tested. The characteristics of these structures and the application for microwave devices are analyzed. -
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